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For inner layers a design rules check called “ clearance do217 trace to plated hole edge ” is not always interpreted in the same way. See the above illustration immediately left of lower part of via hole A in green color. do217 The double arrow marks the correct clearance distance to 200 (um). It must not be measured from the inner edge of the hole, which would be the result if plated (finished) hole size is used.
CAD systems however usually work with finished hole sizes which means that with 150 um (6 mil) over-size drill to allow for plating, 3 mil each side, a setting for this parameter of 200 um will leave 125 um to pass which is not safe to manufacture. The setting must be increased with the 75 um difference which brings do217 it to 275 um, unless CAD system setting allows for this which is unusual. Serious amounts of rework or unusable layouts can result if this is not checked and corrected before a new CAD system do217 is used. Detailed Capability Information Shipco Circuits Ltd. PCB Manufacture Capabilities 2012 Material Type RCC Material Copper thickness 12um, Resin thickness 65 and 100um LDPP (Laser Drill Prepreg Material) IT-180A 1037(2.0 mil), IT-180A 1086 (3.0 mil) FR4 Tg minimum 130 S1144 – standard for 2 layer FR4 Tg minimum 145 S1141 150 - minimum Tg for lead free multilayer Halogen Free Material FR4 Tg minimum 130 S1155 Halogen Free Material FR4 Tg minimum 170 S1165 – for SMT prototypes if repeat soldering of components expected High Tg provides excellent pad bond strength High Tg Material FR4 FR408, IT180A, PLC-370HR, N4000-13, N4000-13SI Hydrocarbon Ceramic do217 High Frequency Material Rogers 4350, Rogers 4003, Arlon 25FR, Arlon 25N PTFE High Frequency do217 Material Rogers Series, Taconics Series, Arlon Series, Nelco Series PTFE Bonding Film RO3001 (1,5mil), HTI.5 (1,5mil), Cuclad 6700 (1,5mil) PTFE Prepreg Model Gore Speed Board C ( 1.5, 2.0, 2.2, 3.4mil) Taconic TPG-30, 32, 35 ( 4.5, 5.0mil ) Production Type Rigid Board Backplane, HDI, Blind & Buried via, Buried Capacitance, Buried do217 Resistance, Electrical source thick copper, Back Drilling Lamination Model Blind&Buried via Type Mechanical Blind&Buried via with less than 3 times laminating HDI Type ( RCC and LDPP ) 1+n+1, 1+1+n+1+1, 2+n+2(Buried via<0.3mm; only for RCC) The Laser Via can be filled with resin or copper Surface Finish Lead Free finishes: HASL lead free, Flash Gold (Base copper <1oz, do217 ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold Plating ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F, ENEPIG Lead finish only: HASL (also now called Tin/Lead HASL) Surface Plating or coating solder thickness (HASL) 2-40um ( minimum 0,4um on large area for HASL!) thicknesses Flash Gold Ni:2.5-5um, Au>0.025um ENIG Ni:2.5-5um, Au 0.05-0.1um Immersion Tin Tin >= 1.0um Immersion Silver Silver: 0.1-0.3um OSP 0.2-0.3um Hard Gold Plating Au max 2.5um ENEPIG do217 For soldering: Ni:3-5um Pd:0.05-0.1um Au:0.03-0.05um For gold wire bonding: Ni:3-5um Pd:0.1-0.15um Au:0.07-0.15um Carbon Thickness 0.10-0.35mm Solder Mask Thickness 10-18um ( On copper area) 5-8um ( On via pad and line corner) Peelable Solder Mask Thickness 0.20-0.50mm Hole Hole Size(finished) Mechanical Drilling 0.10-6.5mm A Min. Hole size is 0.25mm for PTFE Material B The hole size is less than 0.30mm for blind & buried via C The hole size is less than 0.30mm for plugging hole with solder mask in pad D Min. Connection Hole size 0.35mm E The hole size range is 0.10-0.40mm for plugging with resin Hole Size(finished) Laser Drilling A The blind hole size range is 0.075-0.15mm for plugging with resin A The blind hole size range is 0.075-0.127mm for filling plating Aspect Ratio Max PCB THK 1.2mm for mecanical drilling tool diameter 0.15mm Max PCB THK 0.6mm for mecanical drilling tool diameter 0.10mm <16:1 (Tooling size >0.2mm) Hole Position Tolerance 3 mil PTH Size Tolerance 3 mil Press PTH Size Tolernace 2 mil NPTH Size Tolerance 2 mil ( Limited tolerance +0/-2 mil or +2/-0 mil ) The realation between hole size(finished) 0.1mm & 0.15mm (board THK<1.6mm), 0.2mm (board THK<2.4mm ) for plugging with resin and board thickness 0.25mm (board THK<2.8mm ), 0.3mm (board THK<3.2mm do217 ) Min Laser Drill Hole Size 0.10mm (Laser drill depth <65um), 0.13mm (Laser drill depth <100um) The Range of Backdrill Hole Size 0.5-6.5mm The Space of Between the Target Layer <0.20mm To